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VJ5301M915MXBSR
www.vishay.com
Vishay Vitramon
 
Revision: 28-Mar-12
3
Document Number: 45207
For technical questions, contact: chipantenna@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
FOOTPRINT, MECHANICAL AND PCB DIMENSIONS
The antenna footprint and mechanical dimensions are
presented in Figure 7. Optimal tuning is adjusted according
to PCB layout.
For additional mechanical support, it is recommended to
add one drop of heat curing epoxy glue.
" The glue dot should not overlap with any of the soldering
pads
" Apply the glue dot at the center of the antenna.
" The glue dot area secures the chip firmly to the PCB
 Fig. 7 - Footprint, Chip Antenna Mechanical Dimensions, and PCB Layout Dimensions of VJ5301M915
 Fig. 8 - Soldering IR Reflow with SnPb Solder
 Fig. 9 - Soldering Reflow with Sn Solder
 
Time
30 s to 60 s
30 s to 60 s
30 s to 60 s
0
50
100
150
200
250
300
T
C)
> 215 癈: 20 s to 40 s
Max. temperature
Min. temperature
Sn-Pb eutectic solder paste
t (s)
0
50
100
150
200
250
300
T
(癈)
260 癈
50
100
150
200
250
 245 癈
215 癈
180 癈
130 癈
40 s
10 s
10 s
2 K/s
?/DIV>
?/DIV>
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